Philipp Schmidbauer, M. Sc.
Publikationen
Recent Trends in Wafer-Level Package Technology
International Wireless Symposium (, 20. September 2020 - 23. September 2020)
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Concepts for a Monostatic Radar Transceiver Front-end in eWLB Package with Off-Chip Quasi-Circulator for 60 GHz
20th Electronics Packaging Technology Conference (EPTC) (Singapore, 4. Dezember 2018 - 7. Dezember 2018)
In: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
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Wafer Level Package Integrated Antenna Concepts for Circular Polarization
27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (San Jose, CA, 14. Oktober 2018 - 17. Oktober 2018)
In: IEEE (Hrsg.): 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2018
DOI: 10.1109/EPEPS.2018.8534303
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