Philipp Schmidbauer, M. Sc.
Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
Lehrstuhl für Technische Elektronik
- Telefon: +49 9131 85-27195
- Faxnummer: +49 9131 85-28730
- E-Mail: philipp.schmidbauer@fau.de
- Webseite: http://www.lfte.de
Publikationen
- , , , , :
Recent Trends in Wafer-Level Package Technology
International Wireless Symposium (, 20. September 2020 - 23. September 2020)
BibTeX: Download
- , , , :
Concepts for a Monostatic Radar Transceiver Front-end in eWLB Package with Off-Chip Quasi-Circulator for 60 GHz
20th Electronics Packaging Technology Conference (EPTC) (Singapore, 4. Dezember 2018 - 7. Dezember 2018)
In: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
BibTeX: Download - , , , :
Wafer Level Package Integrated Antenna Concepts for Circular Polarization
27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (San Jose, CA, 14. Oktober 2018 - 17. Oktober 2018)
In: IEEE (Hrsg.): 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2018
DOI: 10.1109/EPEPS.2018.8534303
BibTeX: Download